Metall Sheets & Foils

  • Precision up to few µm

  • Little or no heat affected zone (HAZ)

  • Burr free cutting possible

  • Fast cutting speeds and high repetabilaty

PcD & SiLICON WAVER 

The LASER is the ideal tool to cut challenging materials such as Diamond, Ceramics or Silicon 

  • Fast cutting speeds

  • Little Chipping

  • High Cutting quality

Pipes & STENTs

  • Precision cutting using femtosecond lasers

  • Up to 5 axis processing 

  • Creation of directional properties with regards to torsion and bending strength-

  • High productivity combined with low costs compared to conventional technologies